Infineon launches Traveo™ II for vehicle electronic systems

Stephan Zizala
October 5, 2020

Munich, Germany – 5 October 2020 – As drivetrain electrification and advanced driver assistance systems change the way we drive, the number and complexity of comfort features and other body functions in cars increases constantly. To tackle this challenge, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the Traveo™ II Body microcontroller family to the open market. This product family addresses a broad variety of automotive applications, including body control modules, door, window, sunroof and seat control units as well as in-cabin smartphone terminals and wireless charging units. The market launch follows Infineon’s acquisition of Cypress Semiconductor Corporation, which developed the product family.

“Integrating both companies results in the most comprehensive automotive microcontroller portfolio in the industry,” said Peter Schaefer, Senior Vice President and General Manager of Automotive Microcontrollers at Infineon. “The addition of Cypress’ Traveo and Automotive PSoC families to our AURIX safety controllers allows us to offer optimized solutions for the entire range of car applications, from body, cluster and infotainment to chassis, powertrain, driver assistance and domain control.”

Infineon Traveo II Body Family

For body applications, Infineon already offers a variety of sensor and power products ranging from motor control solutions and intelligent power distribution to LED solutions. The Traveo II Body products complement this portfolio with a microcontroller family that delivers the performance, scalability, low power consumption and security required in emerging automotive platforms. “The Traveo II Body family is a cornerstone in our product-to-system approach, allowing us to offer comprehensive system solutions for body applications,” said Peter Schaefer. 

The multicore Traveo II family is based on ARM® Cortex®-M7 and -M4 cores with up to 8 MB of embedded flash that helps the devices deliver the robust performance required for demanding body electronics applications. Compliance to ISO26262 ASIL-B Level ensures a safe operation of the device, even for ambient temperatures up to 125°C.

Featuring advanced peripherals, including support for CAN-FD, Ethernet and FlexRay communication protocols, Traveo II microcontrollers offer scalability and pin-compatibility among all low-end devices as well as among all high-end devices. The family provides low power consumption down to 5 µA and enhanced security (EVITA-Full) for today’s connected cars. Full Firmware-Over-The-Air support allows remote updates of application and security software without any interruption of service.

The microcontrollers are backed by AUTOSAR (AUTomotive Open System ARchitecture) 4.2 software. In addition, a broad ARM-based ecosystem for tools and software is available in the market, ranging from various IDE tools and debugger to real time operating systems.

Availability

The Traveo II Body Family comprises four different series of entry devices and two series of high-end devices, each with a different memory size and pin count. The first entry devices will be available for mass production starting October 2020. The other devices will be rolled out consecutively until the entire product family is available by the second quarter of 2021. Later in 2021, the Traveo II family will be futher complemented with new embedded graphic microcontrollers to continue its strong presence in cluster, cockpit and digital-display applications. Further information is available at www.infineon.com/traveo-II.

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Stephan Zizala
Vice President & General Manager of Automotive High Power, Infineon Technologies

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